Temperature range*: | RT up to 200°C |
Optional | -170°C up to 300°C |
Sample thickness: | From nm to µm range (depends on sample) |
Measurement principle: | chip based (pre-structured measurement chips, 15 pcs. per box) |
Deposition techniques: | include: PVD (sputtering, evaporation), ALD, spin coating, ink-jet printing and more |
Measured parameters: | electrical conductivity / resistivity |
Optional: | Seebeck coefficient Thermal conductivity (3 Omega) Specific heat Hall constant / mobility / charge carrier conc. electromagnet up to 1 T |
Vacuum: | up to 10^-5 mbar |
Electronics: | integrated |
Interface: | USB |
Measurement range | |
Thermal conductivity | 0.05 up to 200 W/m∙K |
Electrical resistivity | 0.05 up to 1 ∙ 10E6S/cm |
Seebeck coefficient | 5 up to 2500 μV/K |
Repeatability & accuracy | |
Thermal conductivity | ± 10% (for most materials) |
Electrical resistivity | ± 6% (for most materials) |
Seebeck coefficient | ± 7% (for most materials) |