Dielectric Analysis

Dielectric cure monitoring


The Dielectric Cure Monitoring series from LINSEIS is used to determine the cure state and viscosity of thermoset materials, chemistry and reaction rate as well as formulation and physical parameters of different materials. It is widely used in QC, QA, R&D and manufacturing field to make quantitative information readily applicable and transferrable to the respectively aspect of polymer processing.

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  • Ovens
  • Presses
  • Autoclaves
  • Pultruders and extruders
  • Batch reaction vessels

Physical:
Dimensions: 17” W x 16” L x 3.25” H
Weight:  16 lbs
Electrical:
Power: 100 VAC – 240 VAC, 50/60 Hz autoswitching universal input, 4 A max
Communications: RS-232C, USB with adapter

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