Tape Line (SSA®)
The OCS Tape Line type SSA® is used in the wire and cable industry to detect surface irregularities (nips) on non-transparent polymer films (tape). The SSA® Line consists of a Measuring Extruder (ME) and a Modular Film Analyser with a Chill Roll (MFA-CR). During surface measurement, the extruded polymer film (tape) passes over a chill roll, which transports the tape to the Surface Quality Analyzer (SQA).
This high-resolution CMOS camera system measures the height of surface defects (also known as nips or agglomerates) with a resolution of 1 µm using a specially developed measuring roll. In addition, the base diameter and the diameter at half the height of the surface defects are measured with a resolution of 10 µm. The provided analysis software allows the user to define height and diameter classes and classify the measured pips based on these definitions.
This high-resolution CMOS camera system measures the height of surface defects (also known as nips or agglomerates) with a resolution of 1 µm using a specially developed measuring roll. In addition, the base diameter and the diameter at half the height of the surface defects are measured with a resolution of 10 µm. The provided analysis software allows the user to define height and diameter classes and classify the measured pips based on these definitions.
The pips can then be marked with the LASER Marking System (LM100) or the Label Printer (LP100). The polymer film is then cut into strips using the OCS Film Cutter and Sorter (OFC100) and sorted into containers. The entire system can be easily managed via the control unit with software-based touch panel, for example to set device parameters, film tension and speed.
Testable Raw Materials: Pellets/non-transparent polymer films (tape), powder and flakes
Testable Raw Materials: Pellets/non-transparent polymer films (tape), powder and flakes
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FEATURES
MODULES INCLUDED
Add-on 1
Add-on 2
Add-on 3
Add-on 4
FEATURES
- Measuring Extruder (ME) comes with flexible height adjustment (infusion position)
- Maintenance and cleaning positions of the Measuring Extruder (ME) can be approached via electric motor
- Modular architecture of the Modular Film Analyser (MFA) to facilitate customisation of additional measuring devices
- Operation via touch panel with data trend as well as optical and acoustic alarm functions
- All system parameters are monitored and saved in the touch panel control system
- Several options for data communication available
MODULES INCLUDED
- Measuring Extruder (ME20/ME25/ME30) with pip die of 50 mm
- Modular Film Analyser with one Chill Roll (MFA-CR)
- Surface Quality Analyser (SQA100) – optionally with Film Thickness Measurement
Add-on 1
Volumetric Resistance Measurement (VRM)
The Volumetric Resistance Measurement (VRM) is an optional measurement system for the Modular Film Analyser (MFA). It enables the inline determination of the specific electrical resistance of conductive polymer films. The measurement is performed by means of a movable measuring head in which measuring and compensation electrodes are integrated. Another feature is the easy operation of the Volumetric Resistance Measurement via the touch panel of the MFA.Testable Materials: Conductive polymer films (tape)
Features
- Measuring head with several compensation electrodes
- Easy operation via the touch panel of the Modular Film Analyser (MFA)
- Security door (including sensor) for monitoring the measurement unit
- OCS Tape Line (SSA)
- OCS Modular Film Analyser (MFA)
Add-on 2
Label Printer (LP100)
The OCS Label Printer (LP100) ensures the highest quality standards with regard to the labelling of, and repair of defects on, polymer films. Simple operation enables reliable and fast printing.Features
- Reliable and fast printing
- Precise impression
- Easy operation
- Compact design
- Meets the highest quality standards
- OCS Tape Line
- OCS Modular Film Analyser (MFA)
Add-on 3
LASER Marking System (LM100)
The OCS LASER Marking System is designed and manufactured using state-of-the-art technology. The LM100 can be used to mark or label defects on polymer films (tape). The labelling and marking settings as well as the power of the laser can be configured with the operator software to the corresponding product requirements. The LASER Marking System consists of laser, control and suction unit.The laser unit essentially consists of a class 4 air-cooled laser, a two-part protective cover, a viewing window and a pneumatically swivelling film guide. The laser unit has two air filters so that neither dirt nor dust accumulates inside its CO2 laser.
Features
- Laser unit with class 4 air-cooled CO2 laser
- Two-part protective cover completely encloses the danger area
- Two air filters prevent dirt and dust from accumulating in the laser unit
- LED lighting
- Pneumatically swivelling film guide
- Adjustable movement speed of the swivel arms
- Viewing window on the laser unit
- Operator software with a wide range of labelling and marking settings
- OCS Tape Line
- OCS Modular Film Analyser (MFA)
Add-on 4
Film Cutter and Sorter (OFC100)
The OCS Film Cutter and Sorter (OFC100) performs two tasks in one system. First, it continuously shreds the polymer film into sections of consistant length (specified value) and ejects them. The ejected film cuttings are then collected in a collection container. The OFC100 automatically sorts out the marked and contaminated film sections with the help of the software. These marked sections are significantly longer for purposes of further analysis and are ejected separately via the sorting ejector into another collection container. Here, too, the length of the marked film sections can be defined.Features
- Automated cutting and sorting unit
- Consistent and definable section length
- Working width of up to 100 mm
- Material thickness of 500 μm
- Automatic sorting of the contaminated/non-contaminated strips into the respective collection container
- Cutting unit completely enclosed and locked by safety circuit and electrical door interlock
- OCS Tape Line
- OCS Modular Film Analyser (MFA)
| Working width | Up to 100 mm |
| Max. material thickness | 500 μm |
RAW MATERIALS INSPECTION SYSTEM
RAW MATERIALS INSPECTION SYSTEM