LMS Scientific Solution Sdn Bhd

Rtec UP-5000 3D Optical Profilometer: The Ultimate Universal Surface Metrology Platform

LMS Scientific Solution Sdn Bhd is proud to present the Rtec UP-5000 3D Universal Optical Profilometer to the Malaysian research, academic, and industrial sectors. As the flagship model of the prestigious Rtec UP Series, the UP-5000 stands alone as the most powerful, uncompromised non-contact surface metrology solution on the market.

Designed with an expansive, automated 300 x 300 x 150 mm XYZ stage and a robust 150-mm Z-axis integrated with an advanced encoder, the UP-5000 provides the ultimate freedom to handle large-scale, heavy, or multi-sample arrays without sacrificing precision. From academic material characterization to rigorous high-tech quality control (QC), the UP-5000 seamlessly bridge the gap from nano-scale to micro-scale topographies.
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5 Core Imaging Modes + Advanced Modularity in One Single Head

The true genius of the Rtec UP-5000 lies in its multi-mode versatility. With just a single click, the system automatically switches between five distinct optical imaging modes directly within the microscope head, eliminating sample relocation artifacts and ensuring total data co-localization
  • White Light Interferometry (WLI): Delivers the highest Z-axis resolution on flat surfaces, achieving sub-nanometer height precision completely independent of magnification.
  • Spinning Disk Confocal Microscopy: Utilizing Rtec’s proprietary Nipkow Confocal (Lambda Head) with thousands of simultaneous pinholes, this mode offers the fastest area scanning on the market, retrieving precise data from steep slopes (up to 72°) and rough or transparent materials.
  • Bright Field Mode: Provides ultra-high-speed, ultra-high-resolution real color 2D imagery.
  • Dark Field Mode: Accentuates contrast to capture micro-cracks, surface defects, and hidden structural failures invisible to standard optics.
  • Focus Variation: Rapidly maps the overarching geometric shape and yields sharp, completely unifocus topologies across wide testing areas.
Beyond 3D Profilometry: The UP-5000 is uniquely expandable. Beyond its 5 core modes, it can be seamlessly upgraded to integrate premium analytical tools including an Atomic Force Microscope (AFM), Raman Microscope, and Spectral Reflectance Profilometry for thin-film and coating thickness inspection.

Engineered for Limitless Applications across Malaysia

No matter the surface condition—be it transparent, rough, dark, reflective, or non-flat—the UP-5000 delivers precise quantitative reports:
  • Semiconductors & Wafers: Inspect wafer bumps, microfluidic channels, vias, pellicles, and microstructures.
  • Advanced Metallurgy & Tooling: Characterize additive manufacturing surfaces, wear volume calculations, scratch tracks, and Vickers hardness indentations.
  • Optics & Specialized Materials: Assess contact lenses, glass topography, thin-film uniformity, and multi-layer reflection mapping.

Intelligent Automation & Compliance

The UP-5000 is built for absolute ease of operation. The entire surface analysis workflow is fully automatic—requiring zero specialized operator expertise to achieve professional results. With just a single button click, the system acquires real color data, executes automatic image stitching across immense surface areas, and outputs standardized quality documentation.
  • Software Power: Native integration with standard-setting Mountains Map software for deep-dive 3D wave tracking, volumetric analysis of wear/holes, roughness distribution, and particle sizing.
  • International Traceability: Completely complies with global tracing frameworks including ISO 25178, ISO 4287, ISO 16610, and EUR 15178.
  • Smart Quality Control: Program customized pass/fail criteria paired with clear green/red traffic light visuals for any selected testing parameter.
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