LMS Scientific Solution Sdn Bhd

Rtec UP-3000 3D Optical Profilometer: The Multi-Mode Metrology Workhorse

LMS Scientific Solution Sdn Bhd is pleased to introduce the Rtec UP-3000 3D Universal Optical Profilometer to the Malaysian scientific and manufacturing sectors. Positioned as the general-purpose industry workhorse of the Rtec lineup, the UP-3000 delivers uncompromising, high-precision non-contact surface measurements on a highly flexible platform.

Engineered with a versatile 150 x 200 x 150 mm XYZ stage and a high-precision cross-roller XY stage, the UP-3000 handles an extensive variety of sample sizes and geometries. It features an advanced compact head architecture uniquely equipped with dual dedicated high-speed cameras designed to independently optimize optical paths, making it the ideal choice for automated industrial inspection, failure analysis, and material research across Malaysia.

5 Imaging Modes in 1 Advanced Profiler Head

The UP-3000 eliminates the need to purchase multiple dedicated microscopes. With a single click of a button, the profilometer automatically switches between five distinct optical imaging techniques within the same head, allowing you to comprehensively characterize any surface type without moving the sample:
  • Spinning Disk Confocal Microscopy: Powered by Rtec’s proprietary Nipkow Confocal Lambda Head, this mode utilizes thousands of simultaneous pinholes on a spinning disk to deliver the fastest area scanning on the market with nanometer resolution. It easily captures high-contrast data from rough samples, transparent materials, and steep slopes up to 72°.
  • White Light Interferometry (WLI): Offers elite, sub-nanometer vertical resolution for flat, smooth, or highly reflective surfaces, providing supreme precision that remains entirely independent of your selected objective magnification.
  • Variable Focus / Focus Variation: Rapidly maps overarching geometric forms and generates sharp, fully unifocus 3D topography images of large surface areas at remarkable speeds.
  • Bright Field Mode: Captures ultra-high-resolution, vibrant real color 2D images for instantaneous surface observation and rapid stitching.
  • Dark Field Mode: Provides unmatched contrast to highlight micro-cracks, deep defects, and fine structural failures that standard optical techniques fail to detect.

Designed to Solve Challenges in Every Sector

From the nano to the micro scale, the UP-3000 adapts perfectly to the rigorous quality control (QC) and R&D requirements of modern industries:
  • Electronics & Semiconductors: Seamlessly inspects wafer features, microstructures, microfluidic chips, and vias.
  • Coatings & Surface Treatments: Conducts detailed scratch analysis, calculates porosity, maps thin-film thickness, and tracks 3D waviness.
  • Precision Tooling & Manufacturing: Evaluates advanced additive manufacturing topography, measures wear track volumes, and analyzes traditional metal surfaces.
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