Using MICRACUT 200-S for Electronics & Semiconductors Sample Preparation

The MICRACUT 200-S is a powerful solution tailored for precise and deformation-free cutting of various materials. When it comes to electronics and semiconductor sample preparation, the MICRACUT 200-S shines in several key areas:

• 1. High-Speed Precision Cutting:
  • The MICRACUT 200-S offers semi-automatic grinding capability, allowing precise material removal from electronics and semiconductor samples.
  • It ensures that delicate structures remain intact during the cutting process, crucial for maintaining sample integrity.


• 2. Angle Grinding Possibility:
  • With the optional angle cutting arm, the MICRACUT 200-S enables angle grinding for specific applications.
  • This flexibility is valuable when dealing with intricate geometries or specific material layers within electronic components.


• 3. Sample Types in Electronics & Semiconductors:
  • Electronics and semiconductor samples fall into four main groups:
    • Silicon Wafers: Used extensively in semiconductor manufacturing.
    • Chip-Based Components: These include integrated circuits (ICs), transistors, capacitors, and resistors.
    • Electronic Components: Such as connectors, diodes, and sensors.
    • Printed Circuit Boards (PCBs): The backbone of electronic devices.
  • The MICRACUT 200-S is particularly adept at handling these small, intricate samples with precision.


• 4. Sample Preparation Workflow:
  • Cutting: When the inspection area lies deep within the sample, cutting can reduce the total grinding depth.
  • Precision Sectioning: Obtain small pieces from large electronic specimens.
  • Cold Mounting: Prepare the sample for subsequent steps
  • Grinding: Precise grinding is the initial step to reveal hidden layers within the sample or focus on specific inspection areas.
  • Polishing: After cutting and grinding, polishing removes scratches and enhances the microstructure for microscopic examination.


• 5. Unique Challenges in Electronics & Semiconductors:
  • Multilayered Structures: Many electronic and semiconductor samples consist of different layers with varying materials (glass, plastic, metals, ceramics, etc.).
  • Microscopic Scale: The structures within these samples are exceptionally small, demanding high-precision sample preparation equipment.
  • Wire Bonding Techniques: Due to the tiny component size, specialized wiring techniques like wire bonding are often employed.


• 6. Efficient Removal of Electronic Components from PCBs:
  • The optional cutting table attachments can be mounted on the MICRACUT 200-S.
  • This feature allows easy and quick removal of electronic components from PCB boards by cutting them precisely using the MICRACUT 200-S.