| Temperature range*: | RT up to 200°C |
| Optional | -170°C up to 300°C |
| Sample thickness: | From nm to µm range (depends on sample) |
| Measurement principle: | chip based (pre-structured measurement chips, 15 pcs. per box) |
| Deposition techniques: | include: PVD (sputtering, evaporation), ALD, spin coating, ink-jet printing and more |
| Measured parameters: | electrical conductivity / resistivity |
| Optional: | Seebeck coefficient Thermal conductivity (3 Omega) Specific heat Hall constant / mobility / charge carrier conc. electromagnet up to 1 T |
| Vacuum: | up to 10^-5 mbar |
| Electronics: | integrated |
| Interface: | USB |
| Measurement range | |
| Thermal conductivity | 0.05 up to 200 W/m∙K |
| Electrical resistivity | 0.05 up to 1 ∙ 10E6S/cm |
| Seebeck coefficient | 5 up to 2500 μV/K |
| Repeatability & accuracy | |
| Thermal conductivity | ± 10% (for most materials) |
| Electrical resistivity | ± 6% (for most materials) |
| Seebeck coefficient | ± 7% (for most materials) |