METKON MICRACUT 200-S
Automatic High-Speed Precision Cutter
MICRACUT 200-S: High-Speed Precision Cutting for Diverse Materials
The MICRACUT 200-S is an automatic high-speed precision cutting machine designed for researchers, material scientists, and quality control professionals in metallurgy, geology, electronics, research, and industrial laboratories. It delivers clean, precise cuts on a wide range of materials, including:
- Metals
- Ceramics
- Electronic components
- Crystals
- Composites
- Biomaterials
- Sintered carbides
- Minerals
Beyond Cutting:
- The MICRACUT 200-S also offers grinding functionality for applications requiring extremely precise material removal.
Universal Design:
- Suitable for both precise cutting and grinding tasks.
- Two cutting table options:
- Fixed table: Ideal for flat samples like PCB boards.
- Movable table: Enables manual table-feed cutting for various materials.
User-Friendly Operation:
- Programmable controls with a colored HMI touch screen for easy operation.
- Motorized Z-axis movement for precise sample positioning.
- High-accuracy X-axis positioning with 5 microns precision.
Efficient Cooling:
- Built-in recirculation coolant tank ensures efficient cooling during cutting and grinding.
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FEATURES
SPECIFICATIONS
ACCESSORIES
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FEATURES
Using MICRACUT 200-S for Electronics & Semiconductors Sample Preparation
The MICRACUT 200-S is a powerful solution tailored for precise and deformation-free cutting of various materials. When it comes to electronics and semiconductor sample preparation, the MICRACUT 200-S shines in several key areas:
In summary, the MICRACUT 200-S is an indispensable tool for electronics and semiconductor laboratories, ensuring meticulous sample preparation for accurate analysis and quality control
The MICRACUT 200-S is a powerful solution tailored for precise and deformation-free cutting of various materials. When it comes to electronics and semiconductor sample preparation, the MICRACUT 200-S shines in several key areas:
- High-Speed Precision Cutting:
- The MICRACUT 200-S offers semi-automatic grinding capability, allowing precise material removal from electronics and semiconductor samples.
- It ensures that delicate structures remain intact during the cutting process, crucial for maintaining sample integrity.
- Angle Grinding Possibility:
- With the optional angle cutting arm, the MICRACUT 200-S enables angle grinding for specific applications.
- This flexibility is valuable when dealing with intricate geometries or specific material layers within electronic components.
- Sample Types in Electronics & Semiconductors:
- Electronics and semiconductor samples fall into four main groups:
- Silicon Wafers: Used extensively in semiconductor manufacturing.
- Chip-Based Components: These include integrated circuits (ICs), transistors, capacitors, and resistors.
- Electronic Components: Such as connectors, diodes, and sensors.
- Printed Circuit Boards (PCBs): The backbone of electronic devices.
- The MICRACUT 200-S is particularly adept at handling these small, intricate samples with precision.
- Electronics and semiconductor samples fall into four main groups:
- Sample Preparation Workflow:
- Cutting: When the inspection area lies deep within the sample, cutting can reduce the total grinding depth.
- Precision Sectioning: Obtain small pieces from large electronic specimens.
- Cold Mounting: Prepare the sample for subsequent steps
- Grinding: Precise grinding is the initial step to reveal hidden layers within the sample or focus on specific inspection areas.
- Polishing: After cutting and grinding, polishing removes scratches and enhances the microstructure for microscopic examination.
- Unique Challenges in Electronics & Semiconductors:
- Multilayered Structures: Many electronic and semiconductor samples consist of different layers with varying materials (glass, plastic, metals, ceramics, etc.).
- Microscopic Scale: The structures within these samples are exceptionally small, demanding high-precision sample preparation equipment.
- Wire Bonding Techniques: Due to the tiny component size, specialized wiring techniques like wire bonding are often employed.
- Efficient Removal of Electronic Components from PCBs:
- The optional cutting table attachments can be mounted on the MICRACUT 200-S.
- This feature allows easy and quick removal of electronic components from PCB boards by cutting them precisely using the MICRACUT 200-S.
In summary, the MICRACUT 200-S is an indispensable tool for electronics and semiconductor laboratories, ensuring meticulous sample preparation for accurate analysis and quality control
SPECIFICATIONS
| Cut-off Wheel Diameter, (mm) | up to Ø200 mm |
| Cutting Capacity, Ø (mm) | Ø75 mm |
| Sample Movement in Z-Axis | Manual |
| X-Axis Positioning Range, (mm) | 0 – 50 mm |
| X-Axis Positioning Accuracy, (μm) | 5 μm |
| Cutting Feed Speed, (μm/s) | 5 – 10000 μm/s |
| Cutting Motor Power, (kW) (S1) | 0.55 kW |
| Disc Speed, (RPM) | 100 – 5000 RPM |
| Control Panel | 7″ HMI Touch Screen |
| Program Capacity | 99 Program Memory |
| Cutting Modes | Automatic Cutting in Z-Axis Manual Cutting in Z-Axis Manual Table-Feed Cutting in Y-Axis |
| Pulse Cutting | Yes (Rapid Pulse Cutting) |
| Automatic Feedrate | Yes (Instafeed Cutting) |
| Multi-Section Cutting | Yes (Hybrid Cutting) |
| Parallel Cutting, X-Axis | Yes (Semi-Automatic) |
| Precise Grinding Feature | Yes (Manual/Semi-Automatic) |
| Grinding Wheel Diameter, (mm) | Ø175 mm |
| Grinding Feed Speed, (μm/s) | 500 – 50000 μm/s |
| Cooling Unit, (l) | 4.5 l (integrated) |
| Illumination | LED |
| Dressing During Cutting Operation | Yes |
| Motor Drive System | Direct Drive |
| Dimensions, W x D x H, (mm) | 640 x 732 x 529 mm |
| Weight | 90 kgs |
ACCESSORIES
| Cutting Tables for MICRACUT 200-S | |
| GR 0215 | Fixed Cutting Table Attachment for manual cutting of extra flat specimens and PCB ‘s on MICRACUT 200-S including angle cutting tool and parallel slicing tool. 288×460 mm table size, cutting capacity is up to 200x200x35 mm (WxDxH) for flat specimens. |
| GR 0216 | Movable Cutting Table Attachment for manual cutting of extra flat specimens, sheet metals and PCB ‘s on MICRACUT 200-S including angle cutting tool, and parallel slicing tool. 288×300 mm table size, 220 mm movement range in Y-axis. cutting capacity is up to 170x200x35 mm (WxDxH) for flat specimens. |
| GR 0223 | Vertical clamping fixture for Movable Cutting Table |
| YM 1590-00 | Dressing Stone |
| Specimen Vises for MICRACUT 200-S | |
| GR 0210 | Universal Specimen Vise for MICRACUT 200-S/202 |
| GR 0400 | Universal Specimen Vise |
| GR 0401 | Specimen vise with double parallel vice for long specimens. |
| GR 0402 | Specimen vise for round and mounted specimens, ø32mm |
| GR 0403 | Specimen vise for irregular shaped specimens. |
| GR 0404 | Specimen vise for adhering specimens. |
| GR 0405 | Specimen vise for biomedical samples. |
| GR 0430 | Specimen vise (teardrop shape) for specimens ø18-40mm. |
| GR 0431 | Specimen vise (teardrop shape) for specimens ø5-20mm. |
| GR 0434 | Specimen vise for round cylindrical specimens (max. up to 40 mm dia.) |
| GR 0406 | Swivel arm unit for angular cutting, MICRACUT 200-S |
| GR 0453 | Fastener vise for longitudinal sectioning of screws, fasteners tubes, etc. from 12 to 45 mm in length |
| Optional Flange Sets for MICRACUT 200-S | |
| GR 0410 | Set of Flanges, ø75 mm, suitable for 12,7 and 25,4 mm arbor dias. |
| GR 0411 | Set of Flanges, ø100 mm, suitable for 12,7 and 25,4 mm arbor dias. |
VIDEO
BROCHURE
| MICRACUT 200-S |  Free Download PDF >> |
| Metkon Sample Preparation Solutions for Electronics Industry | Free Download PDF >> |
METALLOGRAPHIC CUTTING MACHINE
METALLOGRAPHIC CUTTING MACHINE